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By Ralph Remsburg

In a box the place switch and development is inevitable, new digital packaging difficulties consistently come up. Smaller, extra strong units are susceptible to overheating, inflicting intermittent procedure disasters, corrupted signs, decrease MTBF, and outright procedure failure. for the reason that convection cooling is the warmth move direction such a lot engineers take to accommodate thermal difficulties, it's applicable to achieve as a lot knowing in regards to the underlying mechanisms of fluid movement as attainable. Thermal layout of digital apparatus is the single publication that in particular goals the formulation utilized by digital packaging and thermal engineers. It offers warmth move equations facing polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based drinks. rather than counting on theoretical expressions and textual content reasons, the writer provides empirical formulation and sensible ideas that let you quick resolve approximately any thermal engineering challenge in digital packaging.

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Thermal Design of Electronic Equipment

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3 Capacitors Although capacitors are generally thought of as non-power-dissipating, some power is dissipated due to the resistance within the capacitor. 168 k BX X7R X7R BX Z5U Tantalum Tantalum Tantalum Tantalum Tantalum The equivalent series resistance of a capacitor in an AC circuit can lead to significant power dissipation. The average power in such a circuit is given as: t 1 2 PD ϭ --- Ύ I 2 ( t )R ES dt T t1 where RES ϭ equivalent series resistance (⍀). 3 shows the typical resistance of commercial capacitors.

11 shows two-dimensional conduction. 3 Conduction in Spheres2 Description Equations Spherical shell Spherical shell ro 4␲rok⌬T Ti Ϫ To q ϭ ----------------------------------------------- ri ro k ro k ----- Ϫ 1 ϩ  ----- --------- ϩ ----------r i hi r i ho r o ri ro + T i hi k ----- Ϫ 1 ϩ ----------⌬T T Ϫ T r o ho r --------------------o- ϭ ----------------------------------------------⌬T Ti Ϫ To ro k ro k   ----- Ϫ 1 ϩ  ----- --------- ϩ ----------r i r i hi r o ho ri ho To Composite sphere Composite sphere r3 rn rj r2 4 ␲⌬ T T 1 Ϫ T n q ϭ --------------------------------------------------------n nϪ1 1  1 Α ---1-  ---1- Ϫ -----------ϩ Α ---------r  hj+1 r i ϭ 1 ki i kn-1 r1 iϩ1 2 i ϭ 1 r i hi jϪ1 + T1 h1 Α Tn hn 1 1 ----  ---- 1 ------------ 1 ---------- 1 1  ------ 1 --- 1 --------- k  r Ϫ r i ϩ 1 ϩ r 2 h ϩ k j  r j Ϫ r  ϩ r 2 h i ⌬T T j Ϫ T1 i i i iϭ1 i i --------------------- ϭ -------------------------------------------------------------------------------------------n nϪ1 ⌬T Tn Ϫ T1 1  1 Α ---1-  ---1- Ϫ r-----------ϩ Α --------- k r iϭ1 i i iϩ1 2 i ϭ 1 r i hi where Tj is the local temperature in the jth layer.

6 Radial heat conduction through a cylindrical shell having no internal heat generation. 2 Conduction through Cylinders and Spheres In electronic cooling, the most prevalent case of radial heat transfer is the tube containing a flowing coolant. 6). 7 Depiction of the temperature distribution through a compostie cylindrical wall. The thermal energy is applied at r ϭ 0, not at the inner surface, rA. as in the plane wall. 8 Heat conduction through a hollow sphere having a uniform surface temperature and no internal heat generation.

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